FILM FORMING METHOD AND FILM FORMING SYSTEM

摘要

PURPOSE: A film forming method and film forming system is provided to simplify the process of forming two-layer structure of insulation film and hard mask layer without using a CVD device. CONSTITUTION: A film forming method comprises the steps of forming a first coating film by providing a first coating liquid onto a substrate; and a second step of forming a second coating film by providing a second coating liquid onto the first coating film, wherein at least one of first and second coating films is an inorganic film. A film forming system comprises a cassette station for delivering/supplying wafers in cassette units from/to the film forming system; a first treatment station having a plurality of treatment units for performing predetermined treatments during an insulation film forming process; an interface unit arranged to be adjacent to the first treatment station, and which conveys wafers; and a second treatment station having a heat treatment furnace performing a heat treatment in a batch manner.