发明名称 |
INTEGRATED METHOD AND APPARATUS FOR FORMING ENHANCED CAPACITOR |
摘要 |
PURPOSE: Integrated method and apparatus for forming an enhanced capacitor is provided to enable the formation and integration of high quality, high dielectric constant metal-oxide dielectric layers and high quality, low resistance metal-nitride layers at low temperatures. CONSTITUTION: According to an embodiment of the present invention a substrate having a bottom metal electrode is placed in a deposition chamber. The bottom electrode is then exposed to remotely generated nitrogen radicals to passivate the metal electrode. Next, a high dielectric constant metal-oxide dielectric layer such as tantalum pentaoxide (TaO5) or titanium (Ti) doped tantalum pentaoxide (TaO5) or titanium oxide (TiO) is formed over the electrode. The metal-oxide dielectric film is then annealed with remotely generated by activated oxygen atoms. Annealing the metal-oxide dielectric layer with activated oxygen atoms fills vacancies in the metal-oxide dielectric which helps reduce leakage current.
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申请公布号 |
KR20010030487(A) |
申请公布日期 |
2001.04.16 |
申请号 |
KR20000056167 |
申请日期 |
2000.09.25 |
申请人 |
APPLIED MATERIALS INC. |
发明人 |
NARWANKAR PRAVIN;SAHIN TURGUT;URDAHL S. RANDALL |
分类号 |
C23C16/40;C23C16/46;H01L21/02;H01L21/316;H01L21/8242;H01L21/8246;H01L27/105;H01L27/108;(IPC1-7):H01L27/108 |
主分类号 |
C23C16/40 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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