发明名称 INTEGRATED METHOD AND APPARATUS FOR FORMING ENHANCED CAPACITOR
摘要 PURPOSE: Integrated method and apparatus for forming an enhanced capacitor is provided to enable the formation and integration of high quality, high dielectric constant metal-oxide dielectric layers and high quality, low resistance metal-nitride layers at low temperatures. CONSTITUTION: According to an embodiment of the present invention a substrate having a bottom metal electrode is placed in a deposition chamber. The bottom electrode is then exposed to remotely generated nitrogen radicals to passivate the metal electrode. Next, a high dielectric constant metal-oxide dielectric layer such as tantalum pentaoxide (TaO5) or titanium (Ti) doped tantalum pentaoxide (TaO5) or titanium oxide (TiO) is formed over the electrode. The metal-oxide dielectric film is then annealed with remotely generated by activated oxygen atoms. Annealing the metal-oxide dielectric layer with activated oxygen atoms fills vacancies in the metal-oxide dielectric which helps reduce leakage current.
申请公布号 KR20010030487(A) 申请公布日期 2001.04.16
申请号 KR20000056167 申请日期 2000.09.25
申请人 APPLIED MATERIALS INC. 发明人 NARWANKAR PRAVIN;SAHIN TURGUT;URDAHL S. RANDALL
分类号 C23C16/40;C23C16/46;H01L21/02;H01L21/316;H01L21/8242;H01L21/8246;H01L27/105;H01L27/108;(IPC1-7):H01L27/108 主分类号 C23C16/40
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