发明名称 |
SEPARATOR AND SEPARATION METHOD |
摘要 |
<p>A mixture of electronic component chips 2 and media 3 is placed in a planar state on a transport surface 4 of a conveyor 5. Only the media 3 are collected onto a first circulating circumferential surface 18 by a magnetic force provided by a first collection member 12 and are thereafter collected by a media collecting box 22. Then, only electronic component chips 2 having a plating film of a proper thickness formed thereon are attracted onto a second circumferential surface 28 by a magnetic force provided by a second collection member 23 and are thereafter collected by a good product collecting box 31. Electronic component chips 2a having a plating film of an insufficient thickness formed thereon are collected by a defective product collecting box 32.</p> |
申请公布号 |
SG79922(A1) |
申请公布日期 |
2001.04.17 |
申请号 |
SG19960010301 |
申请日期 |
1996.07.23 |
申请人 |
MURATA MANUFACTURING CO., LTD. |
发明人 |
SHIGEO YAICHI;YUJI MURANAKA |
分类号 |
B03C1/12;B03B9/06;B03C1/00;B03C1/02;B03C1/10;B03C1/16;B65G47/46;C25D17/16;(IPC1-7):B03C1/12 |
主分类号 |
B03C1/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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