| 摘要 |
PURPOSE: A method and an apparatus for heating and cooling a substrates are provided to reduce an equipment footprint and increase throughput when compared to conventional substrate heating and cooling systems. CONSTITUTION: The device includes a chamber equipped with a heating mechanism(11) for heating a substrate(25) positioned proximately, a cooling mechanism away from the heating mechanism for cooling the substrate positioned proximately and a transfer mechanism(43) for transferring the substrate between the positions proximate to both the mechanisms. It is preferable the heating mechanism is provided with a substrate-to-be-heated support(15) for supporting the substrate and heating the supported substrate to a prescribed temperature and it is preferable the cooling mechanism is provided with a cooling plate(39). The transfer mechanism can be provided with a plurality of fingers(29) or a plurality of wafer lift pins, for example, for supporting the substrate. In order to feed a dry gas to the chamber, the source of the dry gas can be coupled to the chamber. During cooling, at least, the chamber is exhausted to a prescribed pressure by a pump.
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