| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of fabricating metal particles for anisotropic conductive film, having high hardness, minimal contact failure uniform shape and usable as an alternative to the conventional conductive particles prepared by applying Au plating to resin particles, and the metal particles for anisotropic conductive film. SOLUTION: The method for fabricating the metal particles for anisotropic conductive film comprises steps of: forming a resinoid resist film on a substrate; providing micropores to the resist film; applying plating composed essentially of metal consisting of any of Ni, Cu, Ag and Au to the micropores; melting and removing the above resist; and peeling off the resultant metal plating particles composed essentially of metal consisting any of Ni, Cu, Ag and Au from the above substrate to obtain the metal particles for anisotropic conductive film.
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