| 发明名称 |
REINFORCED SEMICONDUCTOR PACKAGE |
| 摘要 |
A reinforced semiconductor package (20,30) and method utilizes at least one of the grooves (15,16) and ridges (24,25) formed on the package body (17,23) to reinforce the package body (17,23) to prevent warping of the package after molding. |
| 申请公布号 |
SG79982(A1) |
申请公布日期 |
2001.04.17 |
| 申请号 |
SG19980001463 |
申请日期 |
1998.06.18 |
| 申请人 |
TEXAS INSTRUMENTS SINGAPORE (PTE) LTD |
发明人 |
SUAN-JOGN JAE BOON;JING SUA GOH |
| 分类号 |
H01L23/16;(IPC1-7):H01L21/56;H01L23/28;H01L23/31 |
主分类号 |
H01L23/16 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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