| 摘要 |
PROBLEM TO BE SOLVED: To provide a multilayer wiring board which is superior is connection reliability of a wiring circuit layer and via conductors formed by filling a conductor paste. SOLUTION: This multilayer wiring board 1 comprises an insulation board 3, containing at least a thermosetting resin, wiring circuit layers 4 made from a metal foil formed on the insulation board 3 surface and interior, and via hole conductor 5 filled with at least a metal powder 7 for electrically interconnecting the wiring circuit layers 4. Valley parts 6 are continuously formed in the connection side interface of the wiring circuit layers 4 with via hole conductors 5, and the grain size of the metal powder 7 is adjusted, so as to fill the interface regions more than 60% of the valleys 6 with the metal powder 7 in the via conductors 5. |
