PROCEDE DE METALLISATION D'UN SUBSTRAT ISOLANT PAR VOIE ELECTROCHIMIQUE

摘要

The invention relates to a method for metallising an insulating substrate by depositing a thin, uniform film of metal. An insulating substrate is placed in an electrochemical cell containing a solution of a salt of a metal (M), connected to an anode consisting of said metal (M) and to a cathode and electrolysed with a constant current. The method is characterised as follows: a thin conductive film is applied first to the part of the substrate that is in contact with the cathode; the substrate is then placed in the electrochemical cell in such a way that the surface to be metallised is vertical, the cathode being in the top part; and the electrochemical cell is subjected to a current of an intensity able to create a current density of between 1 and 50 mA/cm<2> in the horizontal section of the electrochemical cell at the level of the growing edge of the film being deposited.