| 摘要 |
PROBLEM TO BE SOLVED: To prevent dishing, erosion, or the like generated by excessive polishing, and to reduce the fluctuation of wiring resistance due to wiring density for improving a yield by accurately finding a polishing end point. SOLUTION: In a first polishing device 1, that supplies polishing liquid 31 for polishing a metal layer 26 being formed on the surface to be polished of a substrate 21 to be polished, for example, an atomic absorption photometer, an electrometer, or an ammeter is provided as a detector 19 that measures the amount of constituents of metals contained in the polishing liquid or polishing waste liquid. |
