发明名称 DEVICE FOR FORMING RESIST LAYER ON CONDUCTIVE SUBSTRATE
摘要 PROBLEM TO BE SOLVED: To dispense with the cleaning of a clamping. SOLUTION: A device for forming resist layer on conductive substrate is provided with a controller, having a function of controlling a transporter so as to transport a conductive substrate in one direction, and thereafter in the opposite direction between an application roll and its counter member and another function of controlling opening/closing operation between the application roll and counter member, so that the portions of the substrate having preset lengths from the upper and lower end sections of the substrate is not coated.
申请公布号 JP2001102723(A) 申请公布日期 2001.04.13
申请号 JP19990274294 申请日期 1999.09.28
申请人 KANSAI PAINT CO LTD 发明人 BANDO RYOTA
分类号 H05K3/06;B05C1/02;B05C9/04;B05C13/00;(IPC1-7):H05K3/06 主分类号 H05K3/06
代理机构 代理人
主权项
地址