| 摘要 |
PROBLEM TO BE SOLVED: To provide a multilayer printed wiring board and the manufacturing method thereof which blocks the strippings or crackings due to the thermal expansion coefficient difference between a resin filler and layer insulation resin material, and eliminates deformation of the layer insulation resin layer under the condition of the heat cycle, etc. SOLUTION: This multilayer printed wiring board has a layer insulation resin layer 2 made of a three-layer filmy insulating material containing a first resin film 2a softening in a prescribed heating condition, a second resin film 2b which has a strength greater than that of the first resin 2a and softens in a higher temperature heating condition than that of the first resin 2a, and a B-stage resin 2c. The manufacturing method comprises pressing and heating the filmy insulating material at a prescribed pressure to soften or heating it to soften after pressing, filling and curing the fluidity-increased insulating material in recesses defined by the side faces of inner conductor circuits, including through-hole lands and the board surface and through-holes defined by the inner walls of the through-holes. |
