| 摘要 |
PROBLEM TO BE SOLVED: To obtain a high-reliability wiring board which exhibits proper high-frequency transmission characteristics even if high-frequency transmission tracks are formed on the wiring board which is provided with an insulating substrate containing thermosetting resin. SOLUTION: A fine wiring layer 3, having a width of wire of 0.5 mm or smaller and a wide wiring layer 4 such as ground layer having a width of wire of 1 mm or larger are formed on the surface and/or in the inside of an insulating substrate 2, formed of insulating materials containing thermosetting resin. In this case, by setting the surface roughness of the interface of the fine wiring layer 3 with the insulating substrate 2 to be 0.3μm or smaller and the surface roughness of the interface of the wide wiring layer 4 with the insulating substrate 2 to be 0.3μm or larger, the high-frequency transmission characteristics of a high-frequency transmission tracks using the fine wiring layer 3 as signal conductor line and the wide wiring layer as ground layer are improved.
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