| 摘要 |
PROBLEM TO BE SOLVED: To mount components on a printed wiring board with a high packaging density by reducing the mounting areas of the components, without mounting the components overlap. SOLUTION: A printed wiring board 1 is mounted with components 2 and 3. The components 2 and 3 respectively have leads 4a and 4b and 5a and 5b. The lead 4b of the components 2 is positioned so that the lead 4b may get in a space between the leads 5a and 5b of the parts 3 and the lead 5a of the parts 3 is positioned, so that the lead 5a enters into the space between the leads 4a and 4b of the parts 2.
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