| 摘要 |
PROBLEM TO BE SOLVED: To provide an area mount semiconductor device which is excellent in solder crack resistance. SOLUTION: In the area mount semiconductor device wherein a semiconductor element is mounted on one surface of an organic substrate and only the substantially one surface of the substrate having the semiconductor element mounted thereon is sealed with epoxy resin composition, a solder resist is coated on a part of the organic substrate requiring an insulating property. The epoxy resin composition contains (A) epoxy resin, (B) phenol resin, (C) hardening promotor, (D) inorganic filler and (E) 0.05-2.00 weight % of mercaptosilane in formula (1) with respect to 100 weight % of the total epoxy resin composition. (HSCH2CH2CH2)xSi(OR)y (1) (where, R denotes 1-5C alkyl groups which may have an identical or different carbon numbers from each other, 'x' is 1 or 2, 'y' is 2 or 3, and x+y=4).
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