| 摘要 |
PROBLEM TO BE SOLVED: To improve the high-frequency transmission characteris-tic by diminishing the stray capacitance between metallized layers of the side planes and a metallized wiring layer of the upper surface of a flat part of a ceramic terminal member. SOLUTION: The package consists of a substrate 1 comprising a mounting part 1a for a semiconductor element 5 on its upper surface, a frame body 2 which is attached to the upper surface so as to surround the mounting part 1a and comprises a cutout 2a on its side surface, a flat part 3a composed of a ceramic which is engaged in the cutout 2a and comprises a metallized straight wiring layer 3e conducting through the inside and the outside on the upper surface, and a sanding wall 3b composed of a ceramic junctioned flush with both side walls engaged in the cutout 2a on the flat part 3a. Also, it is provided with a ceramic terminal member 3 which is junctioned with the cutout 2a through a metallized layer which extends over a lower and both sides surface of the flat part 3a which extends over the upper surface and the both sides surface of the standing wall part 3b. The metallized layer 3d of the both sides surface of the ceramic terminal member 3 is clad inside a groove part 3c formed form the upper surface of the standing wall 3b to the lower surface of the flat part 3a.
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