发明名称 SUBSTRATE TREATING METHOD AND APPARATUS THEREOF
摘要 PROBLEM TO BE SOLVED: To provide a method of treating a substrate, preventing a treating liquid left on the substrate from reacting chemically with a following treating liquid, when the substrate is successively treated with several treating liquids. SOLUTION: A substrate 6 is successively treated with several treating liquids through a certain processing method, where a treating liquid supplied to a substrate is reduced in concentration, when a treating liquid is switched from one kind of treating liquid to another.
申请公布号 JP2001102346(A) 申请公布日期 2001.04.13
申请号 JP19990273031 申请日期 1999.09.27
申请人 SHIBAURA MECHATRONICS CORP 发明人 NISHIBE YUKINOBU;ISO AKINORI
分类号 H01L21/304;(IPC1-7):H01L21/304 主分类号 H01L21/304
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