发明名称 |
SUBSTRATE TREATING METHOD AND APPARATUS THEREOF |
摘要 |
PROBLEM TO BE SOLVED: To provide a method of treating a substrate, preventing a treating liquid left on the substrate from reacting chemically with a following treating liquid, when the substrate is successively treated with several treating liquids. SOLUTION: A substrate 6 is successively treated with several treating liquids through a certain processing method, where a treating liquid supplied to a substrate is reduced in concentration, when a treating liquid is switched from one kind of treating liquid to another.
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申请公布号 |
JP2001102346(A) |
申请公布日期 |
2001.04.13 |
申请号 |
JP19990273031 |
申请日期 |
1999.09.27 |
申请人 |
SHIBAURA MECHATRONICS CORP |
发明人 |
NISHIBE YUKINOBU;ISO AKINORI |
分类号 |
H01L21/304;(IPC1-7):H01L21/304 |
主分类号 |
H01L21/304 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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