发明名称 MANUFACTURING METHOD OF IC MOUNTED STRUCTURE AND MANUFACTURING METHOD OF ELECTRIC OPTICAL DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a method for manufacturing an IC mounted structure and a liquid crystal device which can be easily assembled into IC using equipment such as electric equipment. SOLUTION: This method for manufacturing an IC mounted structure comprises an IC mounting process for mounting an IC chip 3 on a drawing part 4c of a substrate 4a and a mold applying process for applying mold 10 to the substrate drawing part 4c on which the IC chip 3 is mounted. Then, the mold 10 applied to the substrate drawing part 4c is pressed by a pressuring member 24 so that the height of the mold 10 can be adjusted so as to be not higher than the height of the IC chip 3.
申请公布号 JP2001102401(A) 申请公布日期 2001.04.13
申请号 JP19990351967 申请日期 1999.12.10
申请人 SEIKO EPSON CORP 发明人 IMAEDA CHIAKI
分类号 H01L21/56;G02F1/1345;G09F9/00;(IPC1-7):H01L21/56;G02F1/134 主分类号 H01L21/56
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