发明名称 MULTIPLE HEAD FOR DIE BONDING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a multiple head to be used for die bonding and capable of widening the degree of flexibility in the arrangement structure of the other members. SOLUTION: This multiple head 11 is used for bonding a chip. A support block 21 is mounted on a head body 12 moving vertically, such that it can rotate in the horizontal direction, and a tool holder 33 is mounted on the support block 21 such that it can rotate in the vertical direction. A plurality of bonding tools 37, corresponding to various kinds of chips, are radially mounted on the outer peripheral portion of the tool holder 33. A female joint 40 is mounted on the rotary shaft 34 of the tool holder 33, and a male joint 68 to be connected to the female joint 40 is mounted on a tool selecting unit 61, independently of the head body 12. The tool selecting unit 61 is moved to bring both the joints 40, 68 into connection, and then the tool holder 33 is rotated to position the predetermined boding tool 37 at the bottom end for the binding use. The multiple head 11 is small in exterior size at the bottom end side to reduce a work space which is to be ensured in the periphery.
申请公布号 JP2001102395(A) 申请公布日期 2001.04.13
申请号 JP19990275953 申请日期 1999.09.29
申请人 NIDEC TOSOK CORP 发明人 NAKATOMI YOSHIHARU
分类号 H01L21/52;(IPC1-7):H01L21/52 主分类号 H01L21/52
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