发明名称 WIRING BOARD AND MOUNTING STRUCTURE
摘要 PROBLEM TO BE SOLVED: To make it possible to keep a wiring board and a semiconductor element package in a stablely connected state to an outer electric circuit (printed board) steadily for a long time. SOLUTION: When a package (A) with a connection electrode 3 is mounted on a printed board (B), on which a connection electrode 11 is provided for connection, a laminated terminal is mounted on the connection electrode 3 of the package (A). The laminated terminal has a laminated body, in which a conductive pillar-shaped body made of metal or resin is laminated with conductive adhesive, and a ratio of H/R, where R is a maximum radius of the laminated body and H is the whole height, is 5 or below.
申请公布号 JP2001102481(A) 申请公布日期 2001.04.13
申请号 JP19990275056 申请日期 1999.09.28
申请人 KYOCERA CORP 发明人 KAWAI SHINYA
分类号 H05K1/18;H01L23/12 主分类号 H05K1/18
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