| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a high-frequency module with good high-frequency transmission characteristics, and provide a manufacturing method. SOLUTION: A high-frequency module includes an FET chip 1 and a substrate 2 with a transmission path, and an electrode pad 1a of the FET chip 1 and a pad 3a of the transmission path are jointed electrically with a connecting path 15. The surface of the FET chip 1 and the surface of the substrate 2 are made flush with each other, and the electrode pad 1a and the transmission pad 3a to be connected to each other with the connection path 15 are located near each other. In this case, the connection path 15 made of a connection path leg 15b as connected to each pad and a connection path main part 15b for jointing two connection path legs 15b is formed integrally.</p> |
