| 摘要 |
PROBLEM TO BE SOLVED: To provide a depth measuring instrument which can take a measurement of depth with higher precision by taking into account the thickness of a thin film, the selection ratio of a sample and the thin film, an aperture rate, the diameter of a hole, a shape, etc., at the start of processing. SOLUTION: This instrument is equipped with a chamber 31 wherein a sample W is processed as specified, a film thickness measuring means which measures the thickness of a thin film on the sample according to reflected light from the sample, and a depth measuring means which measures the depth of a hole bored on the sample according to reflected light from the sample. The depth measuring means corrects the mentioned depth according to the film thickness before the processing by the processing means is started.
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