| 发明名称 |
METHOD OF FORMING MULTILAYER CIRCUIT AND PRINTED WIRING BODY FORMED BY THE SAME |
| 摘要 |
<p>PROBLEM TO BE SOLVED: To allow circuits to be made in the form of a multilayer on a circuit forming board. SOLUTION: Circuits 2 and insulation layers 3 are laminated alternately and printed on a circuit-forming board 1.</p> |
| 申请公布号 |
JP2001102745(A) |
申请公布日期 |
2001.04.13 |
| 申请号 |
JP19990280738 |
申请日期 |
1999.09.30 |
| 申请人 |
TOPPAN FORMS CO LTD |
发明人 |
ENDO YASUHIRO;KAGAMI YASUO;MARUYAMA TORU |
| 分类号 |
H05K3/46;(IPC1-7):H05K3/46 |
主分类号 |
H05K3/46 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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