LED CHIP, LED CHIP ARRAY, LED ARRAY HEAD AND IMAGING APPARATUS

摘要

PROBLEM TO BE SOLVED: To provide an LED array chip in which side effects, e.g. deterioration in the optical characteristics of an LED due to an additional surface protection film, decrease in the quantity of light and increase of variation thereof among emission bits, can be minimized. SOLUTION: In an LED array chip comprising a plurality of LED elements arranged in rows, a surface insulation film of 0.5 μm thick or less is formed entirely on the final surface layer including the surface of light emitting part except pads at wire bonding part using the same material and same thin film forming process as that of an inner layer insulation layer for insulating the wiring pattern connecting window electrically from the inner electric circuit.