发明名称 TEST SOCKET, METHOD OF MANUFACTURING IT, METHOD OF TESTING BY USING IT, AND TESTED MEMBER
摘要 <p>PROBLEM TO BE SOLVED: To provide a socket for testing an electronic instrument or semiconductor package that enables the connection terminal to be securely and continuously electrically connected to an external connection terminal. SOLUTION: Two resilient members are respectively formed at the opposite sides of the leading part of the connection terminal of a socket for testing an electronic instrument or semiconductor package connected to an external connection terminal, so that the force downward from the leading part is equally divided into the two resilient members downwardly displaced without horizontal displacement to cause the reaction force to serve as the connection pressure to the external connection terminal at the leading part. There is no horizontal slide between the leading part and external connection terminal.</p>
申请公布号 JP2001102141(A) 申请公布日期 2001.04.13
申请号 JP20000218988 申请日期 2000.07.19
申请人 MITSUBISHI ELECTRIC CORP 发明人 MAEKAWA SHIGEKI;KASHIBA YOSHIHIRO;TOKUGE YASUSHI;TAKADA SHIGERU
分类号 H01R13/14;H01L23/32;H01R24/00;H01R33/76;H01R43/16;H01R107/00;(IPC1-7):H01R33/76 主分类号 H01R13/14
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