| 摘要 |
PROBLEM TO BE SOLVED: To correct distance measurement error in variation of base line length of structure during heating CCD chips with temperature sensors 31 and 32; by constituting with plastics the structure such as a plastic box 6, a transparent plate 8, CCD holding member 4, etc., constituting CCD package 3a and 3b containing a lens, a lens holding member 2 and CCD chips in a device in which a pair of CCD chips 25' and 26' are arranged on the focus surface of a pair of lenses 1a and 1b to obtain the distance to an object by triangulation principle from the shifting quantity of the object image on the pair of CCD chips; by eliminating thermal expansion of the structural body due to surrounding temperature variation; and by eliminating the thermal deformation of the holding member in the base line direction due to heat conduction from the transparent plate. SOLUTION: Contact ribs 5A having a surface 5 for contacting the transparent plate 8 of a CCD package to CCD holding member 4 are provided in front of and behind a hole HL along a linear line passing the light axis in the linear line direction and crossing perpendicularly on the surface of the transparent plate.
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