发明名称 MULTILAYER PRINTED-CIRCUIT BOARD
摘要 PROBLEM TO BE SOLVED: To obtain a multilayer printed-circuit board, having a function for shielding electromagnetic noise being emitted from an electronic circuit that is formed at a multilayer printed-circuit board and wiring connection structure for securing connecting wiring being laminated in upper and lower directions. SOLUTION: A multilayer printed-circuit board 100 is composed by electrically, directly or indirectly connecting a closed shielding wall 111 of an electrically good conductor that is formed at an electrically good conductor layer of at least one surface of one printed-circuit board 110, by dividing a specific area to the upper end face of a closed shield wall 121 of the electrically good conductor with the same plane shape as the closed shielding wall 111, formed on the electrical good conductor layer of one surface of the other printed-circuit board 120 or the surface of the electrically good conductor layer.
申请公布号 JP2001102762(A) 申请公布日期 2001.04.13
申请号 JP19990275313 申请日期 1999.09.28
申请人 SONY CORP 发明人 MIYAZAKI HIROHITO;WATANABE YOSHIO;YASUDA MASAYUKI;NISHITANI YUJI
分类号 H05K9/00;H05K1/02;H05K3/46;(IPC1-7):H05K3/46 主分类号 H05K9/00
代理机构 代理人
主权项
地址