| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic component for precisely mounting an element in a package. SOLUTION: A plurality of inner connecting elements 14 are formed on the upper edge faces of level differences 22 on the inner wall face of a package 13 so that they can reach the inner peripheral edge, and a shield electrode 15 is formed on the inner bottom face, and shield electrode non-forming parts 18a and 18b are formed so that they can reach the inner peripheral edge. In this case, angles made by one side of the shield electrode non-forming parts 18a and 18b and one side of the inner connecting electrodes 14 are set as right angles, and the cross point of one side of the shield electrode non-forming parts 18a and 18b brought into contact with the side edges of the inner connecting electrodes 14 and one side of the inner connecting terminals 14 brought into contact with the inner peripheral side edge of the package 13 are respectively detected so that a boundary between the inner peripheral edge and inner bottom face of the package when it is viewed from the upper face can be recognized, and that the mounting position of an SAW element 17 on the inner part of the package 13 can be decided. Then, the SAW element 17 is mounted on the upper face of the shield electrode 15, and the SAW element 17 is connected through wires 19 with the inner connecting electrodes 14. |
