MANUFACTURING METHOD OF SEMICONDUCTOR WAFER

摘要

PROBLEM TO BE SOLVED: To accurately control thickness in the manufacturing method of a semiconductor wafer. SOLUTION: This manufacturing method includes grinding processes S14 and S17 that grind at least one of front and back surfaces of a semiconductor wafer being sliced from the ingot of a semiconductor, and a polishing process S18, that polishes the ground surface of the semiconductor wafer after the grinding processes. In the grinding process, the semiconductor wafer is ground down to a predetermined thickness while in the polishing process, the ground surface is polished by a predetermined thickness.