发明名称 |
SIMOX semiconductor structure e.g., wafer comprises a silicon substrate, a doped glass layer produced by ion implantation on the substrate and a silicon layer on the substrate |
摘要 |
SIMOX semiconductor structure comprises a silicon substrate; a doped glass layer produced by ion implantation on the substrate; and a silicon layer on the substrate. An Independent claim is also included for a process for the production of a SIMOX semiconductor structure comprising preparing a silicon substrate; producing a silicon layer on the substrate; and reducing the dislocation density of the silicon layer by implanting ions in the substrate to form a glass layer between the substrate and the silicon layer.
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申请公布号 |
DE10038290(A1) |
申请公布日期 |
2001.04.12 |
申请号 |
DE20001038290 |
申请日期 |
2000.08.05 |
申请人 |
IBM CORP., ARMONK |
发明人 |
HUANG, FENG-YI |
分类号 |
C23C14/48;H01L21/02;H01L21/265;H01L21/762;H01L27/12;(IPC1-7):H01L21/84 |
主分类号 |
C23C14/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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