发明名称 SIMOX semiconductor structure e.g., wafer comprises a silicon substrate, a doped glass layer produced by ion implantation on the substrate and a silicon layer on the substrate
摘要 SIMOX semiconductor structure comprises a silicon substrate; a doped glass layer produced by ion implantation on the substrate; and a silicon layer on the substrate. An Independent claim is also included for a process for the production of a SIMOX semiconductor structure comprising preparing a silicon substrate; producing a silicon layer on the substrate; and reducing the dislocation density of the silicon layer by implanting ions in the substrate to form a glass layer between the substrate and the silicon layer.
申请公布号 DE10038290(A1) 申请公布日期 2001.04.12
申请号 DE20001038290 申请日期 2000.08.05
申请人 IBM CORP., ARMONK 发明人 HUANG, FENG-YI
分类号 C23C14/48;H01L21/02;H01L21/265;H01L21/762;H01L27/12;(IPC1-7):H01L21/84 主分类号 C23C14/48
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