| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a novel printed circuit board, in which adjacent leads or pads can be prevented from being short-circuited with solder at mounting of a semiconductor device or a connector having a relatively limited inter-lead pitch onto a board, and a mask for screen printing on the printed circuit board. SOLUTION: A solder deposit 50 is formed into an 'I-shape' on a conductive pad 40 formed on a substrate 12. First and second parts 52, 54 cover the pad 40 entirely in the lateral direction at the opposite ends thereof by a specified length from the opposite ends in the longitudinal direction, and the first and second parts 52, 54 a third part couples this.</p> |
