发明名称 METHOD FOR FORMING PATTERN
摘要 <p>A method for forming a coating layer (3) crosslinking in the presence of acid on a resist pattern (11) having a thickness of 2 νm or more and formed on a substrate (2), and crosslinking the coating layer (3) contiguous to the resist by diffusion of acid from the resist to the coating layer thereby to thicken the resist pattern and to decrease effectively the dimensions of space parts of a line-and-space pattern, a trench pattern, and a hole pattern, wherein the thickened patterns are prevented from deforming by irradiating the resist pattern (11) with visible light of wavelength band of 150-450 nm or ultraviolet radiation before and/or after forming the coating layer (3). A device, e.g. a magnetic head, can be fabricated faithfully as designed by plating a pattern thus formed.</p>
申请公布号 WO2001025854(P1) 申请公布日期 2001.04.12
申请号 JP2000006940 申请日期 2000.10.04
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