| 摘要 |
PURPOSE:To prevent corrosion of Al on a bad due to moisture, by forming an alumina film at a part, which is not covered with wires, on the surface of the bonding pad on a wire-bonded semiconductor integrated circuit chip by anodic oxidation. CONSTITUTION:The upper and lower sides of a semiconductor integrated device are inverted. The surface of a bonding pad 2 on an integrated circuit chip 1 is immersed in an oxalic acid solution 8. The anode side of a power source is connected to an island 5 and pins 6 of a lead frame. The cathode of the power source is connected to the electrode, i.e., a case 9 of the oxalic acid solution. A specified current is made to flow. An alumina film is formed on a part, which is not covered with wires 4 of the bonding pad 2 and contacted with the oxalic acid solution, by anodic oxidation. Since the alumina film has excellent moisture resistance, the alumina bonding pad is not corroded with moisture intruded from the outside, and reliability is improved. |
