| 摘要 |
The present invention relates to an apparatus for encapsulation and cooling elec-tronic devices, such as printed circuit boards (31). The apparatus comprises at least a first and a second encapsulation part (1, 3) to be assembled for creating an inner space (17) intended to accommodate the electronic devices. At least one of said first and second encapsulation (1, 3) parts is provided with means (27a-b, 29a-b) for supporting the electronic devices within the inner space (17) and means (37) is also provided for liquid-tight sealing of said first and second encapsulation parts (1, 3). At least one of said first and second encapsulation parts (1, 3) is deformable when an under-pressure is created in the inner space (17), whereby said supporting means (27a-b, 29a-b) is forced into clamping engagement with the electronic devices (31). The invention also relates to a method forming such an apparatus. |
