Test device for semiconductor wafers allowing precise determination of the measurement waveform and so compensation for phase shifts during measurement and increased accuracy

摘要

Wafer test card (34) has a needle type contact (342) and an associated earth (343), both being electrically connected to the test head (20). The needle is moved to test different regions of the wafer (W). A measurement component (35) having contact needle (353) and earth (353) is used at the beginning of a test or during a test for measuring and correcting the characteristics of the test signal. An independent claim is made for a procedure for testing a semiconductor wafer.