SOLDERING FLUX, SOLDER PASTE AND METHOD OF SOLDERING

摘要

A method of soldering provides solder bonds of sufficient strength suitable for high-density mounting, miniaturized parts and narrow pitch of parts. The method uses a soldering flux (3) containing adhesive resin and a curing agent. Such flux or paste containing the flux is applied to a circuit board (1), and electronic parts (4) are mounted and soldered.