发明名称 Arrangement and method for producing an electrical contact in an electronic arrangement
摘要 <p>The invention concerns a method and an arrangement in an electronic layout for connecting a component T, such as an electroacoustical transducer, electrically to a circuit card B by means of a contact 2b between a contact spring 3b and a contact surface 4b. The arrangement in the invention involves at least one alternative contact 2c between the contact spring 3b, 3c and said contact surface 4b for various positions of rotation of said component T. Furthermore, the invention concerns a said arrangement comprising an electronic layout and an electroacoustical transducer. In one embodiment, the arrangement comprises at least two separate contact springs 3b, 3c, which are arranged such that at least one of said contact springs 3b, 3c at the same time forms a contact 2b, 2c with said contact surface 4b. In one embodiment, said contact surface 4b is formed as a surface comprising one circular conducting and at least one nonconducting discontinuity site Da. <IMAGE></p>
申请公布号 FI106822(B) 申请公布日期 2001.04.12
申请号 FI19990002081 申请日期 1999.09.29
申请人 NOKIA MOBILE PHONES LTD, 发明人 UUSIMAEKI,MATTI
分类号 H01R24/38;H01R24/50;H05K1/11;H05K3/32;(IPC1-7):H01R12/16 主分类号 H01R24/38
代理机构 代理人
主权项
地址