| 摘要 |
Laser bonding of plastic workpieces (4, 5) to one another or to other materials, using a structured laser opaque mask (3) between a moving linear laser beam source (1) and the workpieces (4, 5), is new. Plastic workpieces (4, 5) are laser bonded to one another or to other materials by (a) positioning a laser opaque workpiece (5) below a laser transparent workpiece (4) facing the laser source (1); (b) positioning a laser opaque mask (3), having structures (9) larger than the laser beam wavelength, between the laser source (1) and the workpieces (4, 5) for bonding the workpieces in a certain joint region (6) of the workpiece contact faces (7); (c) directing the laser source (1) at the contact faces (7) to form a line (8); and (d) moving the laser beam (2) and the mask (3) relative to the workpieces or the laser beam (2) relative to the mask (3) and the workpieces (4, 5). An Independent claim is also included for an apparatus for carrying out the above process, comprising a laser source (1) and a mask (3) of laser opaque material between the workpieces (4, 5) and a mechanism (21, 22) for continuous relative motion between the laser beam (2) and the workpieces (4, 5). Preferred Features: The laser beam (2) is directed perpendicularly onto the joint region (6) and pressure is applied to the workpieces (4, 5) during bonding. One of the workpieces may have a projection adjacent the joint region so that, during compression of the workpieces, a cavity is created between the contact faces. The laser source (1) and the workpieces (4, 5) are moved relative to one another at a high speed dependent on the maximum laser power necessary for achieving the requisite melting temperature, the relative motion optionally being produced by swiveling or rotating a mirror about an axis parallel to the contact faces (7). The laser beam (2) is produced by a semiconductor laser and produces a focal line of constant width and of length determined by the distance of the laser source from the contact faces (7) and corresponding matching of the laser power to the requisite melting temperature. |
