发明名称 |
System and method of forming a tungsten plug |
摘要 |
An electronic device is provided that compromises a dielectric layer (12) disposed outwardly from a substrate (10). The dielectric layer (12) has at least one contact opening (14) formed through the dielectric layer (12). The device has an adhesion layer (16) disposed outwardly from the exposed surfaces of the dielectric layer (12) and the substrate (10). A first barrier layer (18) is formed outwardly from the adhesion layer (16). A second barrier layer (20) is formed outwardly from the first barrier layer (18). A conductive plug (24) fills the contact opening (14) and is disposed outwardly from the second barrier layer (20).
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申请公布号 |
US6215186(B1) |
申请公布日期 |
2001.04.10 |
申请号 |
US19990225576 |
申请日期 |
1999.01.05 |
申请人 |
TEXAS INSTRUMENTS INCORPORATED |
发明人 |
KONECNI ANTHONY J.;BOLNEDI SRIKANTH |
分类号 |
H01L21/768;H01L23/532;(IPC1-7):H01L23/48;H01L23/52 |
主分类号 |
H01L21/768 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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