发明名称 Conditioner and conditioning disk for a CMP pad, and method of fabricating, reworking, and cleaning conditioning disk
摘要 A conditioning disk and a conditioner for a chemical mechanical polishing (CMP) pad, and a method of fabricating, reworking, and cleaning the conditioning disk, are utilized to improve conditioning efficiency, and to reduce production expenses. The conditioning disk for a CMP pad is divided into regions defined by a size difference of abrasive grains formed on the body surface in each region of the conditioning disk. The method of fabricating the conditioning disk is performed by forming adhesive films for attaching the abrasive grains onto the body surface multiple times. In addition, a used conditioning disk may be reworked by detaching the abrasive grains from the body, and attaching new abrasive grains. A used conditioning disk can also be cleaned of by-products of the conditioning process by a cleaning method using a HF solution or BOE (buffered oxide etch) solution.
申请公布号 US6213856(B1) 申请公布日期 2001.04.10
申请号 US19990293946 申请日期 1999.04.19
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 CHO SUNG-BUM;CHOI BAIK-SOON;KIM JIN-SUNG;CHOI KYUE-SANG
分类号 B24B53/14;B24B37/00;B24B37/04;B24B53/017;B24B53/02;B24B53/12;B24D3/00;B24D3/06;B24D7/00;B24D7/06;B24D7/14;B24D18/00;H01L21/304;(IPC1-7):B24B21/18 主分类号 B24B53/14
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