发明名称 |
COMPOSITION, MATERIAL, FILM AND MEMBER FOR HIGH- FREQUENCY WELDING |
摘要 |
PROBLEM TO BE SOLVED: To provide a composition for high-frequency welding which generates heat when exposed to high-frequency waves and which can make various members or materials high-frequency-weldable by applying it to the surface of a substrate to be treated to thereby form a layer thereon or by incorporating it into the substrate. SOLUTION: This composition contains a homopolymer of (A) a polymerizable monomer having an SP value of 9 or lower or a copolymer of (A) a polymerizable monomer having an SP value of 9 or lower and (B) another polymerizable monomer and has a product of permittivity by dielectric loss of 0.01 or higher.
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申请公布号 |
JP2001098240(A) |
申请公布日期 |
2001.04.10 |
申请号 |
JP19990280312 |
申请日期 |
1999.09.30 |
申请人 |
SEKISUI CHEM CO LTD |
发明人 |
TOGAWA KATSUYA;KURODA TAKEO |
分类号 |
C09J157/00;C09J123/04;C09J123/10;C09J123/18;(IPC1-7):C09J157/00 |
主分类号 |
C09J157/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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