发明名称 COMPOSITION, MATERIAL, FILM AND MEMBER FOR HIGH- FREQUENCY WELDING
摘要 PROBLEM TO BE SOLVED: To provide a composition for high-frequency welding which generates heat when exposed to high-frequency waves and which can make various members or materials high-frequency-weldable by applying it to the surface of a substrate to be treated to thereby form a layer thereon or by incorporating it into the substrate. SOLUTION: This composition contains a homopolymer of (A) a polymerizable monomer having an SP value of 9 or lower or a copolymer of (A) a polymerizable monomer having an SP value of 9 or lower and (B) another polymerizable monomer and has a product of permittivity by dielectric loss of 0.01 or higher.
申请公布号 JP2001098240(A) 申请公布日期 2001.04.10
申请号 JP19990280312 申请日期 1999.09.30
申请人 SEKISUI CHEM CO LTD 发明人 TOGAWA KATSUYA;KURODA TAKEO
分类号 C09J157/00;C09J123/04;C09J123/10;C09J123/18;(IPC1-7):C09J157/00 主分类号 C09J157/00
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