Method of producing a semiconductor device

摘要

A method of producing a semiconductor device including a step of forming separation grooves in scribing regions defined at boundary portions between a plurality of semiconductor-device forming portions formed on a top surface of a semiconductor substrate; a step of defining portions of the scribing regions in the semiconductor substrate as substrate connecting portions; and a step of cutting off the substrate connecting portions along the separation grooves, to thereby separate the plurality of semiconductor-device forming portions into chips. These production steps contribute to a higher working efficiency in a later assembling process and to improved mass-production.