| 摘要 |
PROBLEM TO BE SOLVED: To provide a polishing device and its adjusting method, capable of facilitating the replacement of a cushioning material layer when the polishing device is to be adjusted, and of being high in operating performance, and in yield in wafer manufacture without generating polishing scraps by boring holes in the cushioning material layer. SOLUTION: In this invention, the wafer supporting part of a polishing device is furnished with a flat plate part 5 having back pressure gas introducing holes 7 and 8 introducing back pressure gas into a wafer 4, and with a cushioning material layer 6, and it is characteristic that the back pressure gas introducing hole 8 provided for the cushioning material layer 6 is greater in cross sectional area than the back pressure gas introducing hole 7 provided for the flat plate part 5. |
