| 摘要 |
Providing a method for die bonding semiconductor elements surely without causing damage thereto in a shorter time with less steps of operations, thereby improving the productivity.A semiconductor wafer 1 of which back side is laminated onto a wafer sheet 2 covered with thermosetting adhesive layers 43 on both sides thereof is diced, the wafer sheet 2 is expanded to expand the separation groove 41 with the semiconductor elements 3 positioned on die pads 30 while being separated from each other under the condition that the separation groove 41 is expanded, a die bonding head 4 equipped with a compressed air passage 5 and a cutting blade 6 is lowered to cut off the wafer sheet 2 below the expanded separation groove by means of the cutting blade 6 thereby separating the semiconductor elements into individual devices, and compressed air is let out of the compressed air passage 5 to press the semiconductor element 3 thereby bonding the thermosetting adhesive layer 43 of the wafer sheet 2 onto the surface of the die pad 30.
|
