| 摘要 |
An improved hot-melt pressure-sensitive adhesive (HMPSA) composition contains an elastomeric component, such as a blend of SIS and SB block copolymers, and a tackifying component comprising one or more intermediate softening point resins (ISPRs) having a ring and ball softening point of from 35 to 60° C. The improved adhesive compositions are characterized by reduced volatility, less bleed and staining tendencies, and improved overall adhesive performance. The invention also provides improved label constructions in which a release liner is coated with an HMPSA composition and laminated to a flexible facestock. Notably, even when low basis weight paper facestocks are used, the construction can be converted at high speeds.
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