Area array stud bump flip chip device and assembly process

摘要

An area array flip chip device produced using wire bonding technology. The design and process for producing such a flip chip involves stud bumps which are bonded on the substrate, to give good electrical interconnections between the chip pads and the substrate pads. This completely eliminates the limitation of not being able to have stud bump interconnections over the active area of the chip, and allows the stud bump interconnection method to be applied over the entire chip area. The design and process can also be applied to the joining of a substrate or first level packaging to the board. In this embodiment, the stud bump process acts as a replacement for the BGA process.