发明名称 Method of molding a reinforced article
摘要 A method of molding a reinforced article for optimizing heat transfer, electrical conductivity and/or structural integrity is provided. A mold assembly is first provided which is capable of forming an article of a desired configuration. The desired positioning of the filler within the molded article is determined according to the thermal, electrical or structural needs of the article. An input gate and output gate vent is formed in the mold assembly to ensure positioning of the filler as desired. Polymer, loaded with reinforced filler, is introduced into the mold assembly via the input gate. Polymer is positioned in the mold assembly with the reinforcing filler being substantially parallel and aligned with the flow path. Finally, the molded article is ejected from the mold assembly. With the molding method of the present invention, thermal and electrical conductivity and structural integrity of articles may be increased several times over articles molding with conventional molding methods.
申请公布号 US6214263(B1) 申请公布日期 2001.04.10
申请号 US20000522552 申请日期 2000.03.10
申请人 CHIP COOLERS, INC. 发明人 MCCULLOUGH KEVIN A.
分类号 B29C45/46;B29C33/10;B29C45/00;B29C70/14;B29C70/28;B29C70/58;B29C70/62;B29C70/88;B29K105/18;(IPC1-7):B29C70/62;B29C67/24 主分类号 B29C45/46
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