发明名称 SEALING MATERIAL
摘要 PROBLEM TO BE SOLVED: To obtain a sealing material containing no toxic material and capable of sealing a package at <=330 deg.C without loading. SOLUTION: This sealing material is a mixture consisting of 10-55 vol.% of a refractory material powder and 45-90 vol.% of a low melting point composition powder comprising 20-40 mol.% of Ag2O, 0-20 mol.% of AgI, 20-45 mol.% of P2O5, 2-25 mol.% of PbF2+ZnF2+BiF3 and 0-35 mol.% of PbO+ZnO+CuO and <=40 mol.% of PbF2+ZnF2+BiF3+PbO+ZnO+CuO.
申请公布号 JP2001097737(A) 申请公布日期 2001.04.10
申请号 JP20000268744 申请日期 2000.09.05
申请人 NIPPON ELECTRIC GLASS CO LTD 发明人 YAMANAKA TOSHIRO
分类号 C03C8/24;H01L23/10;(IPC1-7):C03C8/24 主分类号 C03C8/24
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