| 摘要 |
A flip chip mounting method and the apparatus have high reliability in electrical connection between a semiconductor and a circuit board so as to avoid void in a via formed in a circuit board or in a recessed portion of a solder resist formed in a circumference of a mounding pad. The flip chip mounting method for connecting a semiconductor element and a circuit board includes steps supplying a thermosetting type resin to a mounting portion on the circuit board, mounting an electrode of the semiconductor element on an electrode of the circuit board under a condition where the semiconductor element is heated by a heating tool, applying a high frequency vibration on the heating tool or the circuit board in the condition where the electrode of the semiconductor element is mounted on the electrode of the circuit board, and heating and pressurizing the thermosetting type resin by the heating tool.
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