| 摘要 |
A semiconductor device which includes a semiconductor chip mounted on a die pad having first and second surfaces opposite to each other with the semiconductor chip mounted on the first surface, and one or a plurality of electrode terminals having third and fourth surfaces opposite to each other and spaced a distance from the die pad and electrically connected with the semiconductor chip through a corresponding wire with the wire being connected to the third surface. Further, a sealing resin encloses the die pad and the electrode terminal. A surface of the die pad opposite to the surface on which the second and fourth surfaces of the die pad and the electrode terminal, respectively, is exposed to an outside of the sealing resin.
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