| 摘要 |
A modular coolant manifold for use with a power electronics device having a heat sink is disclosed. The modular coolant manifold comprises a base unit having an inlet side, an outlet side, and a pair of interconnecting sidewalls. A portion of the base unit defines a recess adapted to receive the heat sink of the electronics device. The base unit includes an internal coolant passage extending between an inlet port defined in the inlet side and an outlet port defined in the outlet side. The coolant passage is in flow communication with the recess. An inlet manifold is adapted for attachment to the base unit inlet side. The inlet manifold includes an inlet port, a transfer port, and a coolant passage interconnecting the inlet port and the transfer port. The inlet manifold transfer port is in flow communication with the base inlet port. An outlet manifold is adapted for attachment to the base unit outlet side. The outlet manifold includes a transfer port, an outlet port, and a coolant passage interconnecting the transfer port and the outlet port. The outlet manifold transfer port is in flow communication with the base unit outlet port. Accordingly, a coolant medium may be communicated through the recess to extract heat from the heat sink.
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